Thin heating device

ABSTRACT

A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards are face-to-face arranged. The elastic connector connects the first and second circuit boards to apply a return force to hold an under-tested device. The heating element is mounted on the first or the second circuit board to heat the under-tested device.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heating device; in particular, to athin thermo-controlling heating device.

2. Description of Related Art

Before packaged integrated circuit elements or memory modules areshipped, a burn-in test is usually carried out to evaluate the stabilityof the aforementioned elements while operating in high-temperature. Inthe so-called burn-in test, the products are placed in a predeterminedhigh temperature ambience and an electrical test is performed. Throughthe Burn-in test, the early fail products could be screened out beforeshipping, and further the quality of the shipped products may beensured.

The conventional method of testing includes the following steps offeeding the memory modules have been tested in room temperature togetherwith the motherboard for test into the oven, and then, testing theperformances of the memory modules, the motherboard and the processor(CPU) in different predetermined temperature through setting the oventemperature. But during the testing process, the memory module, themotherboard and processors for test are heated together, the durabilityof the motherboard and the processors may be shortened, and themalfunctions of the motherboard and the processors may be caused.

Once the malfunctions of the motherboard or the processors happenedduring the process of Burn-in testing, it will cause the distorted testresults of the memory modules.

SUMMARY OF THE INVENTION

The instant disclosure provides a thin heating device. The thin heatingdevice includes a first circuit board, a second circuit board, anelastic connector and a heating element. The first circuit board and thesecond circuit board are connected to the elastic connector, and thefirst circuit board and the second circuit board are disposed facingeach other. The elastic connector connects to the first circuit boardand the second circuit board so that the first circuit board and thesecond circuit board hold a DUT (device under test) by a return force ofthe elastic connector. The heating element is disposed on the firstcircuit board or the second circuit board and is used for heating theDUT.

The thin heating device of the instant disclosure is by combining thetwo circuit boards with the elastic connector, and a heating clip toolto heat the DUT is fabricated. In addition, the motherboard andprocessors for testing the memory modules need not to be heatedsimultaneously while the memory modules in burn-in test. Therefore, thedurability of the motherboard and processors may be prolonged. Besides,the motherboard and processors do not have to operate inhigh-temperature conditions, hence, the probability of malfunctions ofthe motherboard and processors used in test may be decreased.

In order to further the understanding the techniques, methods, andefficacy taken in the present invention to achieve the purpose, thefollowing embodiments are provided along with specifications,illustrations, objects features and characteristics to facilitate thedisclosure of the present invention. However, the accompanying drawingsand attachments are only provided for reference and description and notintended to limit the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a perspective view of the thin heating device holding theDUT according to an embodiment of the instant disclosure;

FIG. 2 shows an exploded diagram of the thin heating device according toan embodiment of the instant disclosure;

FIG. 3A shows a side view of the holding member holding the firstcircuit board and the second circuit board;

FIG. 3B shows a side view of the holding member in use; and

FIG. 4 shows a functional block diagram of the processing moduleaccording to FIG. 1 of an embodiment of the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1, a perspective view of the thin heating deviceaccording to an embodiment of the present invention. The thin heatingdevice 1 of the present embodiment is used to hold a DUT 2 and heat theDUT 2 in burn-in test. The DUT 2, for example, could be memory modules,motherboards, graphics cards, sound cards or memory cards (such asDRAM), or other packaged components which are shaped of card or plate.The DUT 2 is a DRAM memory card in the instant embodiment. In oneembodiment, a seat 3 is disposed on the motherboard 4, which is used inthe test. A slot is formed on the seat 3 for receiving the DUT 2 fortesting. The internal wires are configured in the inner of the seat 3 sothat the transmission of the electrical signals between the DRAM memorycard and the motherboard is allowed when the DRAM memory is plugged intothe slot of the seat 3.

The thin heating device 1 of the present embodiment includes a firstcircuit board 11, a second circuit board 12, an elastic connector 13, atleast one heating element 14, a temperature sensing element 15 and aprocessing module 16.

The elastic connector 13 connects the first and second circuit boards11, 12 such that the first and second circuit boards 11, 12 are facingeach other. When a force is applied to the elastic connector 13 and theelastic connector 13 deforms, the force imparts to the first circuitboard 11 and the second circuit board 12. The return force of theelastic connector 13 facilitates the first and second circuit boards 11,12 holding the DUT 2 therebetween.

Specifically, the first circuit board 11 includes a first holding part110 and a first pressing part 111, and the second circuit board 12includes a second holding part 120 and a second pressing part 121,wherein the first pressing part 111 is connected to the first holdingpart 110 and the second pressing part 121 is connected to the secondholding part 120. The first pressing part 111 is located on a first side11 a of the first circuit board 11, and the second pressing part 121 islocated on a second side 12 a of the second circuit board 12, whereinthe first side 11 a is adjacent to the second side 12 a. Specifically,the first pressing part 111 protrudes from a side edge of the firstholding part 110 and the second pressing part 121 protrudes from thesecond holding part 120.

When the first circuit board 11 and the second circuit board 12 areface-to-face arranged, the first pressing part 111 is set relative tothe second pressing part 121, and the first holding part 110 is setrelative to the second holding part 120. The first holding part 110 andthe second holding part 120 are used for holding the DUT 2. When thefirst pressing part 111 and the second pressing part 121 are pressed,the elastic connector 13 forces the first holding part 110 and thesecond holding part 120 to be in an open state to release the DUT 2.

In the embodiment of the instant disclosure, the elastic connector 13 isset on the first side 11 a of the first circuit board 11 and the secondside 12 a of the second circuit board 12. In detail, the elasticconnector 13 and the first pressing part 111 are set at the same side ofthe first circuit board 11. The first holding part 110 is connected tothe second holding part 120 through the elastic connector 13. The firstholding part 110 and the second holding part 120 could be in an openstate when a force is applied to the elastic connector 13. The firstholding part 110 and the second holding part 120 are in a close statewhen the return force of the elastic connector 13 is applied to thefirst and the second circuit boards 11, 12.

Referring to FIG. 2 shows a perspective exploded view of the thinheating device of an embodiment of the instant disclosure. In theembodiment of the instant disclosure, the elastic connector 13 includestwo holding members 130, wherein the two holding members 130, the firstpressing part 111 and the second pressing part 121 are located on thesame side of the first circuit board 11, and both of the first pressingpart 111 and the second pressing part 121 are arranged between the twoholding members 130.

In detail, the holding member 130 includes two clips 131, 132 and aconnecting part 133, wherein the clips 131, 132 are used for holding thefirst circuit board 11 and the second circuit board 12 respectively andconnected to each other by the connecting part 133. In one embodiment,the clips 131, 132 and the connecting part 133 are formed integrally,and all are elastic steel.

Each of the clips 131, 132 includes a pair of clip sheets, and each ofthe clip sheets has a connecting end and a free end opposite thereto,wherein for the same clip, these clip sheets are arranged facing eachother and connected to each other by these connecting ends.

Specifically, refer to FIG. 3A and FIG. 3B. FIG. 3A shows a side view ofthe holding member holding the first circuit board and the secondcircuit board; FIG. 3B shows a side view of the holding member in use.In FIG. 3A, each of the clips 131, 132 has a first clip sheet 131 a, 132a and a second clip sheet 131 b, 132 b. The clip 132 is similar to theclip 131 in structure and the same description is omitted and the clip131 is further elaborated herein.

As shown in FIG. 3A, the first clip sheet 131 a and the second clipsheet 131 b of the clip 131 are disposed facing each other, and theconnecting ends of the first clip sheet 131 a and second clip sheet 131b are connected to each other to make the clip 131 have an engaging end131 c, and the free ends of the first clip sheet 131 a and the clipsheet 131 b form an opening end of the clip 131. As viewed in thisFigure, the clip 131 is a U-shaped clip with a downward opening.

In addition, the distance between the first clip sheet 131 a and thesecond clip sheet 131 b of the clip 131 is decreasing from the engagingend 131 c to the opening end. That is, the extending directions of thefirst clip sheet 131 a and the second clip sheet 131 b meet at a line.When the first circuit board 11 or the second circuit board 12 is placedinto the space between the first and second clip sheets 131 a, 131 bfrom the opening end, the first circuit board 11 or the second circuitboard 12 would be fastened by the return force of the first clip sheet131 a and the second clip sheet 131 b. The structure of the clip 132 isthe same as the clip 131.

In this embodiment, each clip 131, 132 further includes an elastic sheet131 d, 132 d, the elastic sheet 131 d, 132 d are elastically connectedto the inner wall of the first clip sheet 131 a, 132 a or the secondclip sheet 131 b, 132 b, and can further assist the clip 131,132 tolatch the first circuit board 11 or the second circuit board 12. Furtherexplanation, the elastic sheet 131 d, 132 d and the inner wall of thefirst clip sheet 131 a, 132 a or the second clip sheet 131 b, 132 b forman angle greater than zero, and the elastic sheet 131 d, 132 d extendfrom the inner wall of the first clip sheet 131 a, 132 a or the secondclip sheet 131 b, 132 b toward the engaging end 131 c, 132 c to allowthe entry of the first circuit board 11 or the second circuit board 12from the opening end. When the first circuit board 11 is held by thefirst clip sheet 131 a and the second clip sheet 131 b, the elasticsheet 131 d abuts against the first circuit board 11 by the returnforce, and the second circuit board 12 is held by the first clip sheet132 a and the second clip sheet 132 b in the same manner.

In addition, refer to FIG. 3A. FIG. 3A shows the aforementionedconnecting part 133 is connected to between the free ends of the twoadjacent clips 131 and 132. That is, the connecting part 133 extendsfrom the free end of the first clip sheet 131 a of one of the clip 131to the free end of the first clip sheet 132 a of another clip 132. Theengaging end 131 c, 132 c of these clips 131, 132 are abreast, and theconnected two free ends of the first clip sheets 131 a, 132 a areabreast and located between the other two free ends of the second clipsheets 131 b, 132 b. That is to say, the two clips 131, 132 open towardthe same direction.

Besides, as shown in FIG. 3A, the extending direction of the first clipsheet 131 a of one of the clip 131 meets the extending direction of theclip sheet 132 a of another clip 132. Referring to FIG. 3B, after thefirst circuit board 11 and the second circuit board 12 are held by theclip 131,132 and before the DUT 2 is held, the extending planes of thefirst holding part 110 and the second holding part 120 meet each otherthus in a close state.

The structure of the elastic connector 13 and the circuit board are notlimited to the above embodiment. In another embodiment, the firstcircuit board 11 and the second circuit board 12 are not equipped withthe first pressing part 111 or the second pressing part 121. However,the elastic connector 13 includes two pressing sheets, an axis pin and aspring, wherein each pressing sheet has at least one pivot hole. The twopressing sheets are pivotally connected to each other by the axis pinand the spring going through the pivot hole. Each pressing sheet furtherincludes an engaging part so that the elastic connector 13 is fastenedon the first circuit board 11 and the second circuit board 12 by theengaging part. In this embodiment, the pressing sheet of the elasticconnector 13 is made of heat-resistant or heat insulating material.

Referring to FIG. 1 again, the perspective view of the thin heatingdevice 1 holding the DUT 2 is shown. When the first holding part 110 andthe second holding part 120 hold the DUT 2, the return force of the clip131,132 makes the first holding part 110 and the second holding part 120apply a force to the two opposite sides of the DUT 2 respectively andfasten the DUT 2 so that the inner surface 110 a of the first holdingpart 110 and the inner surface 120 a of the second holding part 120 abutagainst the opposite two sides of the DUT 2.

Referring to FIG. 2 again, the outer surface 110 b of the first holdingpart 110 and the outer surface 120 b of the second holding part 120according to the present embodiment are used for arranging lay-out orsetting functional elements.

In detail, the heating element 14, for heating the DUT 2, is disposed onthe outer surface 110 b of the first holding part 110 or the outersurface 120 b of the second holding part 120. The heating element 14 maybe any component the temperature of which is increasing with theincreasing applied energy, such as an impedance element or a ceramicheating element and the like. In the embodiment of the instantdisclosure, the heating element 14 is used to heat the first circuitboard 11 and the second circuit board 12 to a predetermined temperature.It is due to the effect of heat conduction, the DUT 2 held between thefirst circuit board 11 and the second circuit board 12 will be heated toa predetermined temperature.

In one embodiment, the DUT 2 is a memory module, and has been connectedelectrically to the motherboard 4 and the processor (CPU) for test. Whatshould be mentioned is that the thin heating device 1 of the embodimentof the invention could directly hold the memory module, and heat itwithout simultaneously heating the motherboard 4 and the processor fortest. Therefore, the malfunctions of the motherboard and processor inoperation due to heat may be reduced, and thus the test results would bemore correct.

In one embodiment of the instant disclosure, the temperature sensingelement 15 is also disposed on the outer surface 110 b of the firstholding part 110 and/or the outer surface 120 b of the second holdingpart 120 to monitor the real temperature of the DUT 2. The temperaturesensing element 15 could be contact-type or noncontact-type, and thecontact-type temperature sensing element such as thermocouples,resistance temperature sensors or thermistors. In another embodiment,the temperature sensing element 15 may also be disposed on the innersurface 110 a of the first holding part 110 and/or the outer surface 120a of the second holding part 120 to evaluate the temperature of the DUT2 directly. It should be noted that the temperature sensing element 15is an optional component, and is not necessary to be provided on thecircuit board.

The processing module 16 is electrically connected to the heatingelement 14 and the temperature sensing element 15 so as to control thetemperature of the heating elements 14 applied to the DUT 2 according tothe temperature measured by the temperature sensing element 15. FIG. 4shows a functional block diagram of the thin heating device according toan embodiment of the instant disclosure. The processing module 16includes the user interface 161, the processing unit 162, the feedbackcircuit 163 and port 164.

The processing unit 162 includes a plurality of built-in programs, andthe processing unit 162 is electrically coupled to the user interface161, the heating element 14 and the temperature sensing element 15,wherein the processing unit 162 is electrically connected to thetemperature sensing element 15 through the feedback circuit 163. Thepredetermined parameters inputted by a user are received through theuser interface 161 and then sent to the processing unit 162. Theaforesaid parameters may be the heating temperature, the heating rate,the retention time and so on. Subsequently, according to the parametersinputted by the user, the processing unit 162 controls the heatingtemperature through the heating element 14, thereby to test the DUT 2.

During the heating process, the temperature sensing element 15 transfersthe measured temperature of the first circuit board 11 or the secondcircuit board 12, through the feedback circuit 163 back to theprocessing unit 162 in signal mode. The built-in programs of theprocessing unit 162 can automatically regulate the temperature of theheating element 14 according to the signals transferred by thetemperature sensing element 15 through the feedback circuit 163. In thisembodiment, port 164 could be a USB interface or a RS232 serial port,for selectively connecting external device, such as the detectinginstruments of the memory modules, to control the heating parametersbased on the measured data.

In summary, the thin heating device of the instant disclosure iselastically and pivotally engaged the two circuit boards to form aheating clip tool to heat the DUT. When the memory modules under thetest condition, the thin heating device of the instant disclosure canhold and heat the memory modules without simultaneously heating themotherboard and processor, and thus the durability of the motherboardand the processor may be prolonged. And the motherboard and theprocessor do not have to operate in high-temperature, thus theprobability of malfunctions of the motherboard and the processor may bereduced, and the test results of the memory modules could be moreaccurate.

Furthermore, in the conventional burn-in test, the DUT is placed insideof the oven and not sure for contacting with the heating source, sothere is an error value between the predetermined temperature and theheating temperature for DUT in reality. In other words, the heatingtemperature may be less than the predetermined temperature. It may letthe originally impassible DUT pass the test and may result the qualityauthentication decreases. The thin heating device of an embodiment ofthe instant disclosure heats and holds the DUT by the two circuitboards. It is due to the direct contact between the circuit board andthe DUT, there is a better thermal conduction between the circuit boardand the DUT. Therefore, the decreasing of the error between thetemperature of the DUT and the predetermined temperature could enhancethe quality discrimination. Further, by using the feedback circuit, thethin heating device of the instant disclosure could be auxiliary tocontrol temperature. Furthermore, since the thickness of the circuitboard can be made to less than 0.5 mm, the thin heating device of theembodiment of instant disclosure is more convenient compared toconventional oven.

The foregoing is only preferred possible embodiments of the presentinvention, where any modifications and alterations in accordance withthe claims of the present invention are also belong to the scope of thepresent invention.

What is claimed is:
 1. A thin heating device comprising: at least anelastic connector; a first circuit board and a second circuit board areconnected by the elastic connector such that the first circuit board andthe second circuit board are facing each other, wherein the elasticconnector deforms, and a return force of the elastic connectorfacilitates the first circuit board and the second circuit board holdinga DUT (device under test) therebetween; and at least a heating elementdisposed on the first circuit board or the second circuit board forheating the DUT.
 2. The thin heating device according to claim 1,further comprising: a temperature sensing element disposed on the firstcircuit board or the second circuit board; a processing moduleelectrically coupled to the heating element and the temperature sensingelement, wherein the processing module controls a DUT heatingtemperature through the heating element according to a temperaturedetected by the temperature sensing element.
 3. The thin heating deviceaccording to claim 2, further comprising a feedback circuit, wherein thetemperature sensing element electrically connects to the processingmodule through the feedback circuit, and the processing module controlsthe DUT heating temperature through the heating element according to asignal from the feedback circuit.
 4. The thin heating device accordingto claim 1, wherein the first circuit board comprises a first pressingpart and a first holding part, and the second circuit board comprises asecond pressing part and a second holding part, wherein the firstpressing part protrudes from the first holding part and the secondpressing part protrudes from the second holding part, and the firstholding part and the second holding part are used to hold the DUT, andwhen the first pressing part and the second pressing part are pressed,the elastic connector makes the first holding part and the secondholding part in an open state.
 5. The thin heating device according toclaim 4, wherein the elastic connector comprises two holding members,wherein the holding members and the first pressing part are located atthe same side of the first holding part, and the first pressing part andthe second pressing part are located between the two holding members. 6.The thin heating device according to claim 5, wherein when the twoholding members hold the first circuit board and the second circuitboard respectively, and the first circuit board and the second circuitboard do not hold the DUT, the extension plane of the first circuitboard and the extension plane of the second circuit board meet at aline.
 7. The thin heating device according to claim 1, wherein theelastic connector includes at least one holding member which comprisestwo clips and a connecting part connected therebetween, and the clipshold the first circuit board and the second circuit board respectively.8. The thin heating device according to claim 7, wherein each of theclips includes a pair of clip sheets, and each of the clip sheets has aconnecting end and a free end opposite thereto, wherein the clip sheetsare arranged facing each other and connected to each other by theconnecting ends.
 9. The thin heating device according to claim 8,wherein the connecting part extends from the free end of one of the clipsheets to the free end of another clip sheet, and the connected two freeends are abreast the other two free ends.
 10. The thin heating deviceaccording to claim 9, wherein the two clips open toward the samedirection.
 11. The thin heating device according to claim 8, whereineach of the clips further comprises an elastic sheet elasticallyconnected to an inner wall of one of the two clip sheets, and when thefirst circuit board or the second circuit board are held by the pair ofclip sheets, the elastic sheet abuts the first circuit board or thesecond circuit board.
 12. The thin heating device according to claim 8,wherein when the clips do not hold the first circuit board and thesecond circuit board, the extending planes of the two clip sheets ofeach of the clips meet each other.